DocumentCode
2359603
Title
Hot embossing of micro-featured devices
Author
Chen, S.C. ; Lin, M.C. ; Chien, R.D. ; Liaw, W.L.
Author_Institution
Dept. of Mech. Eng., Chung Yuan Univ., Chung-li, Taiwan
fYear
2005
fDate
10-12 July 2005
Firstpage
777
Lastpage
782
Abstract
Polymer microfabrication methods are becoming increasingly important as low-cost alternatives to the silicon or glass-based MEMS technologies. In this study, micro molding via hot embossing was applied to micro-featured used for DNA/RNA test. LIGA like process using UV light aligner was used to prepare silicon based SU-8 photoresist followed by electroforming to make Ni-Co based stamp. The micro features in the stamp with 5 inch diameter size and 0.2 mm thickness includes 30mum in depth by 100mum in width micro-channel size and 50mum pitch size. PMMA film of 1 mm thickness was utilized as molding substrate. Effect of molding conditions on the replication accuracy was investigated. The imprint width, imprint depth and angle of sidewall of micro-channels were analyzed and correlated. It was found that the molding condition including applied force and embossing temperature are found to all affect the molding accuracy significantly. The imprint depth increases with the imprint force until a saturation value. The imprint depth also increases with the embossing temperature until a saturation value. Basically, 20 kN and 180degC for applied force and embossing temperature can obtain acceptable results when considering molding cycle time. However, 25 kN and 220degC, respectively, under 5 minutes embossing time can obtain a nearly perfect replication in our experiment.
Keywords
LIGA; biomedical equipment; embossing; micromechanical devices; moulding; photoresists; polymers; replica techniques; ultraviolet sources; 180 C; 220 C; MEMS technologies; SU-8 photoresist; UV light aligner; electroforming; embossing temperature; hot embossing; imprint depth; imprint force; imprint width; microchannels; microfeatured devices; micromolding; molding cycle time; molding substrate; polymer microfabrication methods; replication accuracy; sidewall angle; DNA; Embossing; Micromechanical devices; Polymers; RNA; Resists; Silicon; Substrates; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics, 2005. ICM '05. IEEE International Conference on
Conference_Location
Taipei
Print_ISBN
0-7803-8998-0
Type
conf
DOI
10.1109/ICMECH.2005.1529360
Filename
1529360
Link To Document