• DocumentCode
    235970
  • Title

    Development of low carrier density graphene devices

  • Author

    Yanfei Yang ; Lung-I Huang ; Newell, David B. ; Fukuyama, Yasuhiro ; Real, Mariano A. ; Elmquist, Randolph E.

  • Author_Institution
    Nat. Inst. of Stand. & Technol. (NIST), Gaithersburg, MD, USA
  • fYear
    2014
  • fDate
    24-29 Aug. 2014
  • Firstpage
    34
  • Lastpage
    35
  • Abstract
    Epitaxial graphene on SiC(0001) is used to fabricate Hall bar structures for metrological applications with a fabrication process that has been developed to eliminate organic chemical contamination of the graphene. Before any lithographic patterning a metal protection layer of 15 nm thickness is deposited on as-grown graphene. The protection layer on top of the Hall-bar area is etched by diluted fresh aqua regia at the last step of the fabrication, therefore avoiding any contamination from photoresist or photoresist remover. Results including low carrier density and high mobility are reported, along with the appearance of well-developed quantized Hall resistance plateaus for filling factor V=2 at magnetic fields as low as 2 T.
  • Keywords
    Hall effect devices; carrier density; contamination; epitaxial growth; graphene; metallic thin films; photolithography; photoresists; quantum Hall effect; C-Si; Hall bar structure fabrication; carrier density; chemical contamination; epitaxial graphene; filling factor; graphene device; lithographic patterning; magnetic flux density 2 T; metal protection layer deposition; metrological applications; photoresist remover; quantized Hall esistance plateaus; size 15 nm; Charge carrier density; Epitaxial growth; Graphene; Magnetic field measurement; Pollution measurement; Resistance; Standards; Epitaxial graphene; carrier density; device fabrication; quantum Hall effect;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Precision Electromagnetic Measurements (CPEM 2014), 2014 Conference on
  • Conference_Location
    Rio de Janeiro
  • ISSN
    0589-1485
  • Print_ISBN
    978-1-4799-5205-2
  • Type

    conf

  • DOI
    10.1109/CPEM.2014.6898245
  • Filename
    6898245