DocumentCode
235974
Title
Dissipative quantum Hall effect in polycrystalline CVD graphene
Author
Lafont, F. ; Ribeiro-Palau, R. ; Han, Zhu ; Cresti, A. ; Cummings, A.W. ; Roche, S. ; Bouchiat, V. ; Ducourtieux, S. ; Schopfer, Frank ; Poirier, W.
Author_Institution
Lab. Nat. de Metrol. et d´Essais, Trappes, France
fYear
2014
fDate
24-29 Aug. 2014
Firstpage
42
Lastpage
43
Abstract
We report on a study of the quantum Hall effect in large area Hall bars made of polycrystalline graphene grown by chemical vapor deposition and then transferred on SiO2/Si substrate. The longitudinal conductivity σxx measured near Landau Level filling factors ±2, ±6 evidences a strong backscattering of carriers even at T=0.3 K and B=19 T. It results that the Hall resistance is not quantized at the metrological level. σxx increases (decreases) as a function of the temperature (magnetic induction) following unexpected power laws that are not compatible with usual backscattering mechanisms like variable range hopping or inter-Landau level activation. With the support of structural characterizations and numerical simulations, we discuss the role of line defects (wrinkles and grain boundaries) crossing the Hall bar which can short-circuit the counter-propagating edge states.
Keywords
backscatter; chemical vapour deposition; electric resistance measurement; electrical conductivity measurement; graphene; quantum Hall effect; short-circuit currents; C; Hall bar; Landau level filling factor; SiO2-Si; carriers backscattering; chemical vapor deposition; counter propagating edge state; dissipative quantum Hall effect; line defect; longitudinal conductivity measurement; numerical simulation; polycrystalline CVD graphene; resistance metrology; short-circuit current; structural characterizations; Backscatter; Conductivity; Grain boundaries; Graphene; Hall effect; Quantization (signal); Resistance; CVD graphene; Quantum Hall effect; grain boundaries; resistance standards; wrinkles;
fLanguage
English
Publisher
ieee
Conference_Titel
Precision Electromagnetic Measurements (CPEM 2014), 2014 Conference on
Conference_Location
Rio de Janeiro
ISSN
0589-1485
Print_ISBN
978-1-4799-5205-2
Type
conf
DOI
10.1109/CPEM.2014.6898249
Filename
6898249
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