DocumentCode
2359832
Title
Design and fabrication of embedded passives on thin flexible substrates and reliability evaluation of passives performance
Author
Lim, Ying Ying ; Rajoo, Ranjan ; Chong, Ser Choong
Author_Institution
Inst. of Microelectron., A*STAR (Agency for Sci., Singapore, Singapore
fYear
2010
fDate
8-10 Dec. 2010
Firstpage
681
Lastpage
686
Abstract
Recent trends favour the widespread adoption of RFID technology for supply chain and retail applications. To be economically viable, the tags have to be manufactured with a low unit cost. Thus, a fabrication technology which involves inexpensive processes is highly desirable. This work discusses the design and fabrication of embedded passives on flex. In particular, some guidelines are provided for the design of inductors. Lastly, the passives were subjected to some reliability evaluation and their performance ascertained.
Keywords
circuit reliability; flexible electronics; inductors; passive networks; RFID technology; embedded passive fabrication; inductor design; reliability evaluation; supply chain; thin flexible substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location
Singapore
Print_ISBN
978-1-4244-8560-4
Electronic_ISBN
978-1-4244-8561-1
Type
conf
DOI
10.1109/EPTC.2010.5702725
Filename
5702725
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