DocumentCode :
2359832
Title :
Design and fabrication of embedded passives on thin flexible substrates and reliability evaluation of passives performance
Author :
Lim, Ying Ying ; Rajoo, Ranjan ; Chong, Ser Choong
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Singapore, Singapore
fYear :
2010
fDate :
8-10 Dec. 2010
Firstpage :
681
Lastpage :
686
Abstract :
Recent trends favour the widespread adoption of RFID technology for supply chain and retail applications. To be economically viable, the tags have to be manufactured with a low unit cost. Thus, a fabrication technology which involves inexpensive processes is highly desirable. This work discusses the design and fabrication of embedded passives on flex. In particular, some guidelines are provided for the design of inductors. Lastly, the passives were subjected to some reliability evaluation and their performance ascertained.
Keywords :
circuit reliability; flexible electronics; inductors; passive networks; RFID technology; embedded passive fabrication; inductor design; reliability evaluation; supply chain; thin flexible substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-8560-4
Electronic_ISBN :
978-1-4244-8561-1
Type :
conf
DOI :
10.1109/EPTC.2010.5702725
Filename :
5702725
Link To Document :
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