• DocumentCode
    2359832
  • Title

    Design and fabrication of embedded passives on thin flexible substrates and reliability evaluation of passives performance

  • Author

    Lim, Ying Ying ; Rajoo, Ranjan ; Chong, Ser Choong

  • Author_Institution
    Inst. of Microelectron., A*STAR (Agency for Sci., Singapore, Singapore
  • fYear
    2010
  • fDate
    8-10 Dec. 2010
  • Firstpage
    681
  • Lastpage
    686
  • Abstract
    Recent trends favour the widespread adoption of RFID technology for supply chain and retail applications. To be economically viable, the tags have to be manufactured with a low unit cost. Thus, a fabrication technology which involves inexpensive processes is highly desirable. This work discusses the design and fabrication of embedded passives on flex. In particular, some guidelines are provided for the design of inductors. Lastly, the passives were subjected to some reliability evaluation and their performance ascertained.
  • Keywords
    circuit reliability; flexible electronics; inductors; passive networks; RFID technology; embedded passive fabrication; inductor design; reliability evaluation; supply chain; thin flexible substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2010 12th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-8560-4
  • Electronic_ISBN
    978-1-4244-8561-1
  • Type

    conf

  • DOI
    10.1109/EPTC.2010.5702725
  • Filename
    5702725