Fab implementation of a system for cleaning wafers which survive wafer-breakage events

Author

Hilscher, David F.

Author_Institution

MiCRUS, Hopewell Junction, NY, USA

fYear

1998

fDate

23-25 Sep 1998

Firstpage

156

Lastpage

158

Abstract

Wafer-breakage events are detrimental to the productivity of a semiconductor fab in two ways. The loss of product revenue is obvious, but more subtle is the yield impact of wafers in proximity to the breakage event. This collateral damage can impact the final test yield of the surviving wafers, as well as potentially contaminate tools which subsequently process these wafers. This paper describes the evolution and factory-wide implementation of a system for rework cleaning of such wafers, and an estimate of the yield improvement from its implementation

Keywords

fracture; integrated circuit testing; integrated circuit yield; production testing; surface cleaning; surface contamination; collateral damage; factory-wide implementation; final test yield; product revenue loss; productivity; rework cleaning; semiconductor fab; tool contamination; wafer breakage event proximity; wafer cleaning system; wafer fab implementation; wafer-breakage event survival; yield impact; yield improvement; Cleaning; Contamination; Frequency; Inspection; Particle measurements; Pollution measurement; Postal services; Productivity; Silicon; Spraying;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI

Conference_Location

Boston, MA

ISSN

1078-8743

Print_ISBN

0-7803-4380-8

Type

conf

DOI

10.1109/ASMC.1998.731480

Filename

731480