• DocumentCode
    2360022
  • Title

    Packaging and testing of electro-magnetically actuated silicon micro mirror for Pico-projector applications

  • Author

    Xie, Ling ; Myo, Paing ; Choong, Ser Choong ; Ho, Soon Wee ; Wee, Justin ; Premachandran, C.S. ; Wang, Sandy ; Herer, Inbal ; Baram, Adi

  • Author_Institution
    Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
  • fYear
    2010
  • fDate
    8-10 Dec. 2010
  • Firstpage
    731
  • Lastpage
    736
  • Abstract
    Micro mirror packaging development for pico-projector application requires integration of magnets, silicon spacer and glass cap. A multilayer stack package has been designed for large deflection micro mirror. The magnets are used for electromagnetic actuation and are attached on either sides of the silicon beam by a pick and place machine. Different epoxy materials are evaluated to optimize the magnet attachment to the silicon beam. A silicon spacer with a thickness of 500um is epoxy bonded to the micro mirror chip so that after capping the mirror can deflect freely. A glass substrate with antireflection coating is used as a cap for transmitting the light into the mirror. Optical transmission testing at a wavelength of 639nm found that 99%of light can be transmitted through the AR coated glass substrate. The fully package micro mirror device is tested for mirror deflection and found that no performance degradation due to packaging.
  • Keywords
    antireflection coatings; bonding processes; electromagnetic actuators; electronics packaging; elemental semiconductors; glass; micromirrors; silicon; Si; antireflection coating; electromagnetic actuation; epoxy bonding; glass cap; glass substrate; magnet integration; micromirror chip; micromirror packaging; multilayer stack package; optical transmission; pico-projector applications; silicon beam; silicon micromirror; silicon spacer; size 500 mum; wavelength 639 nm;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2010 12th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-8560-4
  • Electronic_ISBN
    978-1-4244-8561-1
  • Type

    conf

  • DOI
    10.1109/EPTC.2010.5702734
  • Filename
    5702734