DocumentCode
2360022
Title
Packaging and testing of electro-magnetically actuated silicon micro mirror for Pico-projector applications
Author
Xie, Ling ; Myo, Paing ; Choong, Ser Choong ; Ho, Soon Wee ; Wee, Justin ; Premachandran, C.S. ; Wang, Sandy ; Herer, Inbal ; Baram, Adi
Author_Institution
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
fYear
2010
fDate
8-10 Dec. 2010
Firstpage
731
Lastpage
736
Abstract
Micro mirror packaging development for pico-projector application requires integration of magnets, silicon spacer and glass cap. A multilayer stack package has been designed for large deflection micro mirror. The magnets are used for electromagnetic actuation and are attached on either sides of the silicon beam by a pick and place machine. Different epoxy materials are evaluated to optimize the magnet attachment to the silicon beam. A silicon spacer with a thickness of 500um is epoxy bonded to the micro mirror chip so that after capping the mirror can deflect freely. A glass substrate with antireflection coating is used as a cap for transmitting the light into the mirror. Optical transmission testing at a wavelength of 639nm found that 99%of light can be transmitted through the AR coated glass substrate. The fully package micro mirror device is tested for mirror deflection and found that no performance degradation due to packaging.
Keywords
antireflection coatings; bonding processes; electromagnetic actuators; electronics packaging; elemental semiconductors; glass; micromirrors; silicon; Si; antireflection coating; electromagnetic actuation; epoxy bonding; glass cap; glass substrate; magnet integration; micromirror chip; micromirror packaging; multilayer stack package; optical transmission; pico-projector applications; silicon beam; silicon micromirror; silicon spacer; size 500 mum; wavelength 639 nm;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location
Singapore
Print_ISBN
978-1-4244-8560-4
Electronic_ISBN
978-1-4244-8561-1
Type
conf
DOI
10.1109/EPTC.2010.5702734
Filename
5702734
Link To Document