Title :
Packaging and testing of electro-magnetically actuated silicon micro mirror for Pico-projector applications
Author :
Xie, Ling ; Myo, Paing ; Choong, Ser Choong ; Ho, Soon Wee ; Wee, Justin ; Premachandran, C.S. ; Wang, Sandy ; Herer, Inbal ; Baram, Adi
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
Micro mirror packaging development for pico-projector application requires integration of magnets, silicon spacer and glass cap. A multilayer stack package has been designed for large deflection micro mirror. The magnets are used for electromagnetic actuation and are attached on either sides of the silicon beam by a pick and place machine. Different epoxy materials are evaluated to optimize the magnet attachment to the silicon beam. A silicon spacer with a thickness of 500um is epoxy bonded to the micro mirror chip so that after capping the mirror can deflect freely. A glass substrate with antireflection coating is used as a cap for transmitting the light into the mirror. Optical transmission testing at a wavelength of 639nm found that 99%of light can be transmitted through the AR coated glass substrate. The fully package micro mirror device is tested for mirror deflection and found that no performance degradation due to packaging.
Keywords :
antireflection coatings; bonding processes; electromagnetic actuators; electronics packaging; elemental semiconductors; glass; micromirrors; silicon; Si; antireflection coating; electromagnetic actuation; epoxy bonding; glass cap; glass substrate; magnet integration; micromirror chip; micromirror packaging; multilayer stack package; optical transmission; pico-projector applications; silicon beam; silicon micromirror; silicon spacer; size 500 mum; wavelength 639 nm;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-8560-4
Electronic_ISBN :
978-1-4244-8561-1
DOI :
10.1109/EPTC.2010.5702734
