Influence of PCB design and materials on chip solder joint reliability

Author

Berthou, M. ; Retailleau, P. ; Frémont, H. ; Guédon-Gracia, A. ; Jéphos-Davennel, C.

Author_Institution

MBDA France, Le Plessis-Robinson, France

fYear

2010

fDate

26-28 April 2010

Firstpage

1

Lastpage

6

Abstract

This paper describes chip solder joint reliability on three substrate types: one board SMI (aluminium substrate) and two different boards in FR4. Several chip sizes and types (resistor, capacitor) were assembled on these boards. Accelerated Thermal cycles (ATC) -55/+125Â°C were applied to evaluate the lifetime of chip solder joints. The different results obtained showed an important dispersion in Time To Failure (TTF) according to the substrate type. Literature data confirm this dispersion. To understand this discrepancy Finite Element Modelling (FEM) analyses were used to evaluate the influence of PCB design and materials on solder chip component reliability. The simulations permit to identify which parameters are the most influent.

Keywords

finite element analysis; printed circuit design; reliability; solders; PCB design; accelerated thermal cycles; chip solder joint; finite element modelling; reliability; time to failure; Acceleration; Aluminum; Assembly; Copper; Environmentally friendly manufacturing techniques; Fatigue; Joining materials; Lead; Materials reliability; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on

Conference_Location

Bordeaux

Print_ISBN

978-1-4244-7026-6

Type

conf

DOI

10.1109/ESIME.2010.5464569

Filename

5464569