Title :
Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality
Author :
Spaan, E. ; Ooms, E. ; van Driel, W.D. ; Yuan, C.X. ; Yang, D.G. ; Zhang, G.Q.
Author_Institution :
NXP Semicond., Nijmegen, Netherlands
Abstract :
In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.
Keywords :
copper; lead bonding; numerical analysis; Cu; bondpads; numerical approach; wire bonding quality; Bonding forces; Bonding processes; Copper; Design optimization; Gold; Manufacturing; Materials reliability; Materials testing; Wafer bonding; Wire;
Conference_Titel :
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location :
Bordeaux
Print_ISBN :
978-1-4244-7026-6
DOI :
10.1109/ESIME.2010.5464572
