UV curing kinetic of high performance epoxy resin for Roll-to-Roll UV embossing

Author

Voytekunas, V. Yu ; Ng, F.L. ; Shan, X.C. ; Lu, C.W. ; Abadie, M.J.M.

Author_Institution

Singapore Inst. of Manuf. Technol. (SIMTech), Singapore, Singapore

fYear

2010

fDate

8-10 Dec. 2010

Firstpage

819

Lastpage

824

Abstract

In present work curing kinetics of UV-initiated cationic photo-polymerization of EPICLON series epoxy resin HP-820 and key cure process parameters, such as the extent of cross-linking and conversion, polymerization rate and the order of reactions have been studied by Photo-Differential Scanning Calorimetry (DPC). Different kinetics analysis results, including enthalpy of the reaction, induction time, peak maximum, percentage conversion were obtained for studied epoxy system at different isothermal temperatures (30-70°C), allowing calculating activation energy. Two kinetic parameters - coefficient rate (k) and the order of the initiating reaction (m) were determined, using an autocatalytic kinetics model.

Keywords

catalysis; curing; differential scanning calorimetry; embossing; enthalpy; polymerisation; reaction rate constants; resins; ultraviolet radiation effects; DPC; EPICLON series epoxy resin HP-820; UV curing kinetic; UV-initiated cationic photo-polymerization; activation energy; autocatalytic kinetics model; coefficient rate; cross-linking; enthalpy of the reaction; epoxy system; high performance epoxy resin; induction time; initiating reaction; isothermal temperatures; key cure process parameters; kinetic parameters; kinetics analysis; order of reactions; peak maximum; percentage conversion; photo-differential scanning calorimetry; polymerization rate; roll-to-roll UV embossing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2010 12th

Conference_Location

Singapore

Print_ISBN

978-1-4244-8560-4

Electronic_ISBN

978-1-4244-8561-1

Type

conf

DOI

10.1109/EPTC.2010.5702743

Filename

5702743