Process of new negative photo-dielectric polymer ALX with high reliability

Author

Wang, Orson ; Eriguchi, Takeshi ; Tsuruoka, Kaori ; Zhang, Yong ; Kuriyama, Hijiri ; Shiraishi, Kenichi

Author_Institution

Res. Center, AGC Asahi Glass Co. Ltd., Yokohama, Japan

fYear

2010

fDate

8-10 Dec. 2010

Firstpage

832

Lastpage

834

Abstract

We present the results of study on the manufacturability and reliability of ALX211 polymer in wafer level packaging processes and structures. Previously, the processing windows of ALX211 polymer and the impact of the delays between processing steps on the stability of the process were studied. In this paper, we present a new method to achieve high resolution using ALX211, by putting a certain period of dwell time between treatment with AP903 and processing ALX211, and utilizing relatively low exposure dose. In addition, we present reliability results comparing the performance of polyimide, BCB, and ALX211 as evaluated in a bump-on-polymer test structure. Results of board level temperature cycling testing are presented.

Keywords

integrated circuit reliability; integrated circuit testing; photodielectric effect; polymers; wafer level packaging; ALX211 polymer; board level temperature cycling testing; bump-on-polymer test structure; negative photodielectric polymer; reliability; wafer level packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2010 12th

Conference_Location

Singapore

Print_ISBN

978-1-4244-8560-4

Electronic_ISBN

978-1-4244-8561-1

Type

conf

DOI

10.1109/EPTC.2010.5702745

Filename

5702745