• DocumentCode
    2360309
  • Title

    Can Carbon Nanotubes Extend the Lifetime of On-Chip Electrical Interconnections?

  • Author

    Banerjee, Kaustav ; Im, Sungjun ; Srivastava, Navin

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
  • fYear
    2006
  • fDate
    Sept. 2006
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    Current earning capacity of copper interconnects is being severely limited due to their increasing resistivity with scaling and reliability constraints. Metallic carbon nanotubes (CNT) are promising candidates that can potentially address the challenges faced by copper and thereby extend the lifetime of on-chip electrical interconnects. This paper provides an overview of the state-of-the-art of CNT interconnect research and discusses both advantages and challenges of this emerging nanotechnology
  • Keywords
    carbon nanotubes; copper; integrated circuit interconnections; CNT interconnect; Cu; metallic carbon nanotubes; nanotechnology; on-chip electrical interconnections; Carbon nanotubes; Conductivity; Copper; Electrons; Fabrication; Grain boundaries; Integrated circuit interconnections; Scattering; Temperature; Wires; Carbon nanotubes; VLSI; copper; interconnects;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano-Networks and Workshops, 2006. NanoNet '06. 1st International Conference on
  • Conference_Location
    Lausanne
  • Print_ISBN
    1-4244-0391-X
  • Type

    conf

  • DOI
    10.1109/NANONET.2006.346235
  • Filename
    4152818