DocumentCode
2360309
Title
Can Carbon Nanotubes Extend the Lifetime of On-Chip Electrical Interconnections?
Author
Banerjee, Kaustav ; Im, Sungjun ; Srivastava, Navin
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
fYear
2006
fDate
Sept. 2006
Firstpage
1
Lastpage
9
Abstract
Current earning capacity of copper interconnects is being severely limited due to their increasing resistivity with scaling and reliability constraints. Metallic carbon nanotubes (CNT) are promising candidates that can potentially address the challenges faced by copper and thereby extend the lifetime of on-chip electrical interconnects. This paper provides an overview of the state-of-the-art of CNT interconnect research and discusses both advantages and challenges of this emerging nanotechnology
Keywords
carbon nanotubes; copper; integrated circuit interconnections; CNT interconnect; Cu; metallic carbon nanotubes; nanotechnology; on-chip electrical interconnections; Carbon nanotubes; Conductivity; Copper; Electrons; Fabrication; Grain boundaries; Integrated circuit interconnections; Scattering; Temperature; Wires; Carbon nanotubes; VLSI; copper; interconnects;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano-Networks and Workshops, 2006. NanoNet '06. 1st International Conference on
Conference_Location
Lausanne
Print_ISBN
1-4244-0391-X
Type
conf
DOI
10.1109/NANONET.2006.346235
Filename
4152818
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