• DocumentCode
    2360343
  • Title

    Bevatron local injector duoplasmatron ion source performance

  • Author

    Stover, G. ; Zajec, E.

  • Author_Institution
    Lawrence Berkeley Lab., California Univ., CA, USA
  • fYear
    1989
  • fDate
    20-23 Mar 1989
  • Firstpage
    292
  • Abstract
    Performance tests of the Bevatron local injector duoplasmatron ion source using singly charged particles of helium and deuterium are described. Initial measurements of the 8.4-keV/nucleon helium 1+ beam and deuterium 1+ beams indicated intensities of 12 particle mA and 8 particle mA, respectively. The low-energy beam transport line uses a tape-wound solenoid and an x-y dipole for matching into the 200-MHz RF quadrupole (RFQ) linac. A beam profile monitor and Faraday cup are located in the diagnostic box pumping manifold assembly. The computer control system, the AC distribution network, and pulsed gas control system are similar to those of the local injector PIG source in that they are housed in an insulated four bay rack in a room directly above the source. The source lifetime of 150 h is governed by the evaporation rate of the 1-mm diameter tantalum filament, and is increased to several months during operation with the directly heated lanthanum hexaboride filament
  • Keywords
    beam handling equipment; ion sources; particle beam diagnostics; 150 h; 200 MHz; AC distribution network; Bevatron local injector duoplasmatron ion source; D; Faraday cup; He; LaB6; RFQ linac; Ta filament; beam profile monitor; computer control system; diagnostic box pumping manifold assembly; low-energy beam transport line; performance tests; pulsed gas control system; singly charged particles; source lifetime; tape-wound solenoid; x-y dipole; Control systems; Deuterium; Helium; Ion sources; Nuclear measurements; Particle beam measurements; Particle beams; Particle measurements; Solenoids; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Particle Accelerator Conference, 1989. Accelerator Science and Technology., Proceedings of the 1989 IEEE
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/PAC.1989.73150
  • Filename
    73150