DocumentCode :
2360366
Title :
Numerical approach to multiscale evaluation and analysis of Tg of crosslinked polymers
Author :
Tesarski, Sebastian J. ; Hölck, Ole ; Wymyslowski, Artur
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
fYear :
2010
fDate :
26-28 April 2010
Firstpage :
1
Lastpage :
4
Abstract :
Molecular modeling is one of the fastest developing tools in material science. There are a couple of reasons of such a state: on one hand molecular modeling seems to be nowadays much more user friendly and on the other hand is much more efficient in comparison to research based on traditional experiments, which are quite expensive and long lasting. Though the basic problem of numerical analysis is accuracy, in certain cases we can agree with it as long as the predicted tendency or trends are assessed properly. Due to the current state of the art it is justified to formulate the assumption that that results of advanced numerical modeling fulfills expected convergence criteria and correlates well with the experimental data.
Keywords :
glass transition; molecular dynamics method; polymers; thermal analysis; thermal expansion; crosslinked polymers; glass transition temperature; microelectronic packaging; molecular modeling; multiscale evaluation; nanoelectronic packaging; numerical analysis; scripting capability; thermal expansion; Algorithms; Epoxy resins; Materials science and technology; Microelectronics; Numerical analysis; Numerical models; Packaging; Photonics; Polymers; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location :
Bordeaux
Print_ISBN :
978-1-4244-7026-6
Type :
conf
DOI :
10.1109/ESIME.2010.5464580
Filename :
5464580
Link To Document :
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