• DocumentCode
    2360469
  • Title

    Design and fabrication of Si-neuroprobe arrays

  • Author

    Murthy, B. Ramana ; Ramakrishna, Kotlanka ; Ranganathan, Nagarajan ; Giao, Teh Poh ; Tay, Guang Kai Ignatius ; Je, Minkyu ; Agarwal, Ajay

  • Author_Institution
    Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
  • fYear
    2010
  • fDate
    8-10 Dec. 2010
  • Firstpage
    796
  • Lastpage
    800
  • Abstract
    In this work we proposed designs and demonstrated the fabrication of silicon microprobes for neural prosthesis. Silicon probes of various sizes, cross-sectional shapes and involving different probe encapsulation bio-compatible materials such as Polyimide were fabricated. Especially, isotropically etched (for Si) probes find significant application to reduce tissue trauma during implant. Our approach of using fully CMOS compatible silicon wafer processing with 200mm diameter silicon wafers is to subsequently serve as an enabling platform for manufacture-able process leading to low cost neurodevices. Silicon probes thus fabricated were packaged in order to demonstrate the complete product cycle- “Design-to-Packaging”.
  • Keywords
    CMOS integrated circuits; biomedical electronics; biomedical materials; integrated circuit design; integrated circuit packaging; neurophysiology; prosthetics; silicon; Si; Si-neuroprobe arrays; biocompatible materials; biomedical implant; design-to-packaging; fully CMOS compatible silicon wafer processing; low cost neurodevices; neural prosthesis; polyimide; probe encapsulation; product cycle; silicon microprobes; tissue trauma;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2010 12th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-8560-4
  • Electronic_ISBN
    978-1-4244-8561-1
  • Type

    conf

  • DOI
    10.1109/EPTC.2010.5702758
  • Filename
    5702758