DocumentCode
2360469
Title
Design and fabrication of Si-neuroprobe arrays
Author
Murthy, B. Ramana ; Ramakrishna, Kotlanka ; Ranganathan, Nagarajan ; Giao, Teh Poh ; Tay, Guang Kai Ignatius ; Je, Minkyu ; Agarwal, Ajay
Author_Institution
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
fYear
2010
fDate
8-10 Dec. 2010
Firstpage
796
Lastpage
800
Abstract
In this work we proposed designs and demonstrated the fabrication of silicon microprobes for neural prosthesis. Silicon probes of various sizes, cross-sectional shapes and involving different probe encapsulation bio-compatible materials such as Polyimide were fabricated. Especially, isotropically etched (for Si) probes find significant application to reduce tissue trauma during implant. Our approach of using fully CMOS compatible silicon wafer processing with 200mm diameter silicon wafers is to subsequently serve as an enabling platform for manufacture-able process leading to low cost neurodevices. Silicon probes thus fabricated were packaged in order to demonstrate the complete product cycle- “Design-to-Packaging”.
Keywords
CMOS integrated circuits; biomedical electronics; biomedical materials; integrated circuit design; integrated circuit packaging; neurophysiology; prosthetics; silicon; Si; Si-neuroprobe arrays; biocompatible materials; biomedical implant; design-to-packaging; fully CMOS compatible silicon wafer processing; low cost neurodevices; neural prosthesis; polyimide; probe encapsulation; product cycle; silicon microprobes; tissue trauma;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location
Singapore
Print_ISBN
978-1-4244-8560-4
Electronic_ISBN
978-1-4244-8561-1
Type
conf
DOI
10.1109/EPTC.2010.5702758
Filename
5702758
Link To Document