Title :
Design and fabrication of Si-neuroprobe arrays
Author :
Murthy, B. Ramana ; Ramakrishna, Kotlanka ; Ranganathan, Nagarajan ; Giao, Teh Poh ; Tay, Guang Kai Ignatius ; Je, Minkyu ; Agarwal, Ajay
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
In this work we proposed designs and demonstrated the fabrication of silicon microprobes for neural prosthesis. Silicon probes of various sizes, cross-sectional shapes and involving different probe encapsulation bio-compatible materials such as Polyimide were fabricated. Especially, isotropically etched (for Si) probes find significant application to reduce tissue trauma during implant. Our approach of using fully CMOS compatible silicon wafer processing with 200mm diameter silicon wafers is to subsequently serve as an enabling platform for manufacture-able process leading to low cost neurodevices. Silicon probes thus fabricated were packaged in order to demonstrate the complete product cycle- “Design-to-Packaging”.
Keywords :
CMOS integrated circuits; biomedical electronics; biomedical materials; integrated circuit design; integrated circuit packaging; neurophysiology; prosthetics; silicon; Si; Si-neuroprobe arrays; biocompatible materials; biomedical implant; design-to-packaging; fully CMOS compatible silicon wafer processing; low cost neurodevices; neural prosthesis; polyimide; probe encapsulation; product cycle; silicon microprobes; tissue trauma;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-8560-4
Electronic_ISBN :
978-1-4244-8561-1
DOI :
10.1109/EPTC.2010.5702758