• DocumentCode
    2360590
  • Title

    Global 2D modeling of minority and majority substrate coupled currents

  • Author

    Conte, Fabrizio Lo ; Sallese, Jean-Michel ; Pastre, Marc ; Krummenacher, Francois ; Kayal, Maher

  • Author_Institution
    Electron. Lab., EPFL, Lausanne, Switzerland
  • fYear
    2009
  • fDate
    14-18 Sept. 2009
  • Firstpage
    153
  • Lastpage
    156
  • Abstract
    This paper presents a modeling strategy to simulate 2D propagation of electrical perturbations induced by direct biasing of substrate junctions. Identifying parasitic substrate devices such as bipolar transistors reaches rapidly its limit when multiple current paths exist as in two-dimensional devices. In this work, we propose to map the substrate using only PN junctions and diffusion resistances. The model of these components has been extended in order to satisfy the majority and minority carrier continuity equation at the boundary of the component. A typical 2D parasitic structure has been simulated and the results are in good agreements with finite element simulation. The proposed approach reduces drastically the time needed to simulate a complex structure such as a whole IC substrate.
  • Keywords
    bipolar transistors; finite element analysis; p-n junctions; semiconductor device models; 2D parasitic structure; PN junctions; bipolar transistors; diffusion resistances; electrical perturbation 2D propagation; finite element simulation; global 2D modeling; majority carrier continuity equation; minority carrier continuity equation; multiple current paths; parasitic substrate devices; two-dimensional devices; Bipolar transistors; Diodes; Equations; Finite element methods; Integrated circuit interconnections; Laboratories; Low voltage; MOSFETs; Power integrated circuits; Resistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European
  • Conference_Location
    Athens
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4244-4351-2
  • Electronic_ISBN
    1930-8876
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2009.5331455
  • Filename
    5331455