Failure modes of Wafer Level Thin Film MEMS packages during wafer thinning

Author

Zaal, J.J.M. ; van Driel, W.D. ; Zhang, G.Q.

Author_Institution

Dept. PME, Delft Univ. of Technol., Delft, Netherlands

fYear

2010

fDate

26-28 April 2010

Firstpage

1

Lastpage

6

Abstract

An increasing number of semiconductor companies have research programs related to MEMS resonators. This can be explained by the possible wide range of application areas. Many resonators operate in vacuum and sealing of the cavity can be obtained by using a Wafer Level Thin Film Package (WLTFP). To fit the MEMS-die into a small package it needs to be thinned. In this paper the effect of wafer thinning on the WLTFP is investigated by means of simulation and experiments. The effects of tape removal on WLTFP´s are simulated in 2 and 3 dimensions using the cohesive zones technique. Necessary adhesive properties of the grinding foil are measured by a grinding tape peeling experiment. In 2D FE simulations damage is included to predict the most likely cracking path.

Keywords

adhesives; cavity resonators; finite element analysis; thin film devices; wafer level packaging; 2D FE simulations; MEMS resonators; cohesive zones technique; failure modes; grinding tape peeling; semiconductor companies; wafer level thin film MEMS packages; wafer thinning; Micromechanical devices; Packaging; Transistors; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on

Conference_Location

Bordeaux

Print_ISBN

978-1-4244-7026-6

Type

conf

DOI

10.1109/ESIME.2010.5464595

Filename

5464595