DocumentCode
2360660
Title
Experimental evaluation of trapping efficiency in silicon nitride based charge trapping memories
Author
Suhane, A. ; Arreghini, A. ; Van den Bosch, G. ; Breuil, L. ; Cacciato, A. ; Rothschild, A. ; Jurczak, M. ; Van Houdt, J. ; De Meyer, K.
fYear
2009
fDate
14-18 Sept. 2009
Firstpage
276
Lastpage
279
Abstract
A characterization technique capable of measuring the electrical charge injected during programming operations in silicon nitride based charge trapping memories has been developed. The trapping efficiency, defined as the fraction of carriers which gets trapped in the device with respect to the total injected charge, is extracted and is evaluated along the programming transient for a wide set of devices, featuring different material deposition techniques and different thicknesses. The trapping efficiency is found to be almost insensitive to the injection conditions, whereas it depends on the quantity of filled traps, the thickness of the trapping layer and the conduction band offset between the trapping layer and the top oxide. A higher trapping efficiency in general leads to faster programming transients and more effective programming when increasing the gate voltage.
Keywords
charge injection; electron traps; semiconductor storage; silicon compounds; wide band gap semiconductors; SiN; charge trapping memories; conduction band offset; electrical charge injection; material deposition technique; programming transients; silicon nitride; trapping efficiency; Conducting materials; Current measurement; Dielectric materials; Dielectric substrates; Dynamic programming; Electron traps; Pulse measurements; Silicon compounds; Threshold voltage; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European
Conference_Location
Athens
ISSN
1930-8876
Print_ISBN
978-1-4244-4351-2
Electronic_ISBN
1930-8876
Type
conf
DOI
10.1109/ESSDERC.2009.5331460
Filename
5331460
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