3CEO: Three dimensional Cmesh based electrical-optical router for networks-on-chip

In this paper, we propose a novel router and an associated algorithm for a new type of NoC that is 3-dimensionally integrated using Cmesh topology and TSVs. It utilizes both optical interconnects (OIs) and electrical interconnects (EIs) to overcome the physical limitations of Cmesh topology and thus improves throughput due to decreased concentration rate of the router. Simulation results showed about 19% throughput improvement and 48% reduction in power consumption compared to existing 3D mesh NoC, and 70% throughput improvement and 28% reduction in power consumption compared to 3D Cmesh NoC using only EIs.