Title :
Mechanical properties of an epoxy modeled using particle dynamics, as parameterized through molecular modeling
Author_Institution :
Honeywell Specialty Materials, USA
Abstract :
The current paper applies both molecular modeling and mesoscale modeling to determine modulus and defect formation in epoxy and epoxy-copper interfaces. The results will show that molecular modeling may be applied directly to parameterize the bead properties used in the mesoscale model, which scale to the physical properties.
Keywords :
copper; deformation; interface states; resins; Cu; defect formation; epoxy; mesoscale modeling; molecular modeling; particle dynamics; Bonding; Bridges; Chemistry; Copper; Finite element methods; Joining processes; Material properties; Mechanical factors; Polymers; Silicon compounds;
Conference_Titel :
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location :
Bordeaux
Print_ISBN :
978-1-4244-7026-6
DOI :
10.1109/ESIME.2010.5464611
