Title :
Influence of Skin Effect on MOSFET Losses
Author :
Elbanhawy, Alan ; Newberry, William
Author_Institution :
Fairchild Semicond., San Jose, CA
Abstract :
As the personal computer makers push for DC-DC converters delivering 200 Amps at 1 V within the next three years, the semiconductor manufacturers are pushing to optimize their MOSFET by improving both the silicon and the packages to provide switching devices suitable for these challenges. In this paper we address the parasitic resistance attributed to the package alone and in isolation from the silicon on-resistance. We show that in most of the traditional packages this resistance has a very strong frequency dependant component. This means that at a switching frequency of about a few megahertz, this parasitic resistance will constitute a large percentage of the total device on-resistance. Based on this observation, we concentrate on the synchronous buck converter and we derive conduction loss equations that are frequency dependent and calculate actual losses and examine several effects that follow
Keywords :
DC-DC power convertors; elemental semiconductors; losses; power MOSFET; semiconductor device packaging; silicon; skin effect; 1 V; 200 A; DC-DC converters; MOSFET losses; conduction loss equations; parasitic resistance; semiconductor manufacturers; silicon on-resistance; skin effect; switching devices; switching frequency; synchronous buck converter; Computer aided manufacturing; DC-DC power converters; Frequency; MOSFET circuits; Microcomputers; Semiconductor device manufacture; Semiconductor device packaging; Silicon; Skin effect; Switching converters;
Conference_Titel :
IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on
Conference_Location :
Paris
Print_ISBN :
1-4244-0390-1
DOI :
10.1109/IECON.2006.347282