DocumentCode :
2361121
Title :
Influence of Skin Effect on MOSFET Losses
Author :
Elbanhawy, Alan ; Newberry, William
Author_Institution :
Fairchild Semicond., San Jose, CA
fYear :
2006
fDate :
6-10 Nov. 2006
Firstpage :
2313
Lastpage :
2317
Abstract :
As the personal computer makers push for DC-DC converters delivering 200 Amps at 1 V within the next three years, the semiconductor manufacturers are pushing to optimize their MOSFET by improving both the silicon and the packages to provide switching devices suitable for these challenges. In this paper we address the parasitic resistance attributed to the package alone and in isolation from the silicon on-resistance. We show that in most of the traditional packages this resistance has a very strong frequency dependant component. This means that at a switching frequency of about a few megahertz, this parasitic resistance will constitute a large percentage of the total device on-resistance. Based on this observation, we concentrate on the synchronous buck converter and we derive conduction loss equations that are frequency dependent and calculate actual losses and examine several effects that follow
Keywords :
DC-DC power convertors; elemental semiconductors; losses; power MOSFET; semiconductor device packaging; silicon; skin effect; 1 V; 200 A; DC-DC converters; MOSFET losses; conduction loss equations; parasitic resistance; semiconductor manufacturers; silicon on-resistance; skin effect; switching devices; switching frequency; synchronous buck converter; Computer aided manufacturing; DC-DC power converters; Frequency; MOSFET circuits; Microcomputers; Semiconductor device manufacture; Semiconductor device packaging; Silicon; Skin effect; Switching converters;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on
Conference_Location :
Paris
ISSN :
1553-572X
Print_ISBN :
1-4244-0390-1
Type :
conf
DOI :
10.1109/IECON.2006.347282
Filename :
4152864
Link To Document :
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