DocumentCode
2361121
Title
Influence of Skin Effect on MOSFET Losses
Author
Elbanhawy, Alan ; Newberry, William
Author_Institution
Fairchild Semicond., San Jose, CA
fYear
2006
fDate
6-10 Nov. 2006
Firstpage
2313
Lastpage
2317
Abstract
As the personal computer makers push for DC-DC converters delivering 200 Amps at 1 V within the next three years, the semiconductor manufacturers are pushing to optimize their MOSFET by improving both the silicon and the packages to provide switching devices suitable for these challenges. In this paper we address the parasitic resistance attributed to the package alone and in isolation from the silicon on-resistance. We show that in most of the traditional packages this resistance has a very strong frequency dependant component. This means that at a switching frequency of about a few megahertz, this parasitic resistance will constitute a large percentage of the total device on-resistance. Based on this observation, we concentrate on the synchronous buck converter and we derive conduction loss equations that are frequency dependent and calculate actual losses and examine several effects that follow
Keywords
DC-DC power convertors; elemental semiconductors; losses; power MOSFET; semiconductor device packaging; silicon; skin effect; 1 V; 200 A; DC-DC converters; MOSFET losses; conduction loss equations; parasitic resistance; semiconductor manufacturers; silicon on-resistance; skin effect; switching devices; switching frequency; synchronous buck converter; Computer aided manufacturing; DC-DC power converters; Frequency; MOSFET circuits; Microcomputers; Semiconductor device manufacture; Semiconductor device packaging; Silicon; Skin effect; Switching converters;
fLanguage
English
Publisher
ieee
Conference_Titel
IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on
Conference_Location
Paris
ISSN
1553-572X
Print_ISBN
1-4244-0390-1
Type
conf
DOI
10.1109/IECON.2006.347282
Filename
4152864
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