• DocumentCode
    2361121
  • Title

    Influence of Skin Effect on MOSFET Losses

  • Author

    Elbanhawy, Alan ; Newberry, William

  • Author_Institution
    Fairchild Semicond., San Jose, CA
  • fYear
    2006
  • fDate
    6-10 Nov. 2006
  • Firstpage
    2313
  • Lastpage
    2317
  • Abstract
    As the personal computer makers push for DC-DC converters delivering 200 Amps at 1 V within the next three years, the semiconductor manufacturers are pushing to optimize their MOSFET by improving both the silicon and the packages to provide switching devices suitable for these challenges. In this paper we address the parasitic resistance attributed to the package alone and in isolation from the silicon on-resistance. We show that in most of the traditional packages this resistance has a very strong frequency dependant component. This means that at a switching frequency of about a few megahertz, this parasitic resistance will constitute a large percentage of the total device on-resistance. Based on this observation, we concentrate on the synchronous buck converter and we derive conduction loss equations that are frequency dependent and calculate actual losses and examine several effects that follow
  • Keywords
    DC-DC power convertors; elemental semiconductors; losses; power MOSFET; semiconductor device packaging; silicon; skin effect; 1 V; 200 A; DC-DC converters; MOSFET losses; conduction loss equations; parasitic resistance; semiconductor manufacturers; silicon on-resistance; skin effect; switching devices; switching frequency; synchronous buck converter; Computer aided manufacturing; DC-DC power converters; Frequency; MOSFET circuits; Microcomputers; Semiconductor device manufacture; Semiconductor device packaging; Silicon; Skin effect; Switching converters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on
  • Conference_Location
    Paris
  • ISSN
    1553-572X
  • Print_ISBN
    1-4244-0390-1
  • Type

    conf

  • DOI
    10.1109/IECON.2006.347282
  • Filename
    4152864