Overcoming the barriers to cleaning with bubble-free ozonated de-ionized water

Author

Bush, Timothy M. ; Hardwick, Steven J. ; Wikol, Michael J.

Author_Institution

W.L. Gore & Assoc. Inc., Elkton, MD, USA

fYear

1998

fDate

23-25 Sep 1998

Firstpage

226

Lastpage

229

Abstract

The need for significant reductions in water consumption as 300 mm wafer processes are commercialized is driving the development of revolutionary new wet cleaning processes. Most of these new processes incorporate ozonated de-ionized water as a key processing step. The use of membrane contactors to infuse ozone into water uniquely enables the production of bubble-free de-ionized water. Bubble-free ozonated fluids are the critical enabling technology for the next generation of critical cleaning

Keywords

bubbles; chemical technology; integrated circuit technology; membranes; ozone; surface cleaning; surface contamination; water; 300 mm; O₃-H₂O; bubble-free de-ionized water production; bubble-free ozonated de-ionized water; bubble-free ozonated fluids; cleaning; critical cleaning; critical enabling technology; membrane contactors; ozonated de-ionized water; ozone infusion; processing step; wafer processes; wafer size; water consumption; wet cleaning processes; Airports; Biomembranes; Chemical processes; Commercialization; Contactors; Green cleaning; Measurement units; Production; Water conservation; Water pollution;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI

Conference_Location

Boston, MA

ISSN

1078-8743

Print_ISBN

0-7803-4380-8

Type

conf

DOI

10.1109/ASMC.1998.731559

Filename

731559