DocumentCode
2361608
Title
Measuring the Load-Carrying Capability of IPMC Microgripper Fingers
Author
Deole, Ujwal ; Lumia, Ron
Author_Institution
Monsanto Co., St. Louis, MO
fYear
2006
fDate
6-10 Nov. 2006
Firstpage
2933
Lastpage
2938
Abstract
The goal of this work is to develop a microgripper using ionic polymer metal composite (IPMC), an electroactive material, and to understand the relationship between finger shape and load-carrying capability. This microgripper supports manipulation of rigid and flexible objects in wet and dry environments. The paper first describes the design of the microgripper, which consists of a "pincher" mechanism that holds the IPMC fingers. Two finger shapes are considered. The first shape, denoted as "straight" fingers, is tested for load-carrying capability by picking up pre-weighed micro-balls of solder. Since IPMC is a compliant material, it was expected that shorter length fingers would carry more load. We found experimentally a linear relationship between finger length and load-carrying capability. The second finger shape is tapered. This finger shape was compared with the straight fingers by measuring the load-carrying performance of several different sizes of each finger shape. It was found that shape has a relatively minor effect. The load-carrying capability was found to be related primarily to the area of the finger. Thus, the microgripper finger shape should be chosen based on the ease of manufacturing. In terms of total strength, it was noted that the microgripper carried loads that exceed the weight of the fingers by a factor of seven
Keywords
grippers; micromanipulators; electroactive material; ionic polymer metal composite; load-carrying capability; microgripper fingers; pincher mechanism; Actuators; Assembly; Composite materials; Fingers; Grippers; Inorganic materials; Micromechanical devices; Polymers; Shape measurement; Shape memory alloys;
fLanguage
English
Publisher
ieee
Conference_Titel
IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on
Conference_Location
Paris
ISSN
1553-572X
Print_ISBN
1-4244-0390-1
Type
conf
DOI
10.1109/IECON.2006.347378
Filename
4152885
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