Title :
The quantitation of surface modifications in 200 and 300 mm wafer processing with an automated contact angle system
Author :
Carpio, Ronald ; Hudson, David
Author_Institution :
Sematech, Austin, TX, USA
Abstract :
Contact angle measurement, using advanced instrumentation, is assuming an increased role in monitoring those semiconductor manufacturing processes which modify the surface characteristics of wafers. Such measurements can provide rapid, nondestructive and spatially and time resolved data in an automated mode. This information can be related to processing uniformity and can in many cases provide information on the chemical state of the surface. Illustrations are provided in the wafer cleaning, lithography, and interconnect areas. New application areas illustrated include measurement of the uniformity of UV photostabilization processes, measurement of contrast curves, and determination of receding and advancing contact angles of processed copper wafers
Keywords :
angular measurement; computerised instrumentation; contact angle; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; integrated circuit yield; lithography; process monitoring; surface cleaning; 200 mm; 300 mm; Cu; UV photostabilization process uniformity; advancing contact angles; automated contact angle system; contact angle measurement; contrast curves; instrumentation; interconnects; lithography; monitoring; nondestructive measurements; processed copper wafers; processing uniformity; receding contact angles; semiconductor manufacturing processes; spatially resolved measurements; surface chemical state; surface modification quantitation; surface modifications; time resolved measurements; wafer cleaning; wafer processing; wafer surface characteristics; Area measurement; Chemical processes; Cleaning; Goniometers; Instruments; Lithography; Manufacturing processes; Monitoring; Spatial resolution; Time measurement;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-4380-8
DOI :
10.1109/ASMC.1998.731571
