Title :
Copper interconnect technology-new paradigms for BEOL manufacturing
Author :
Rose, Kenneth ; Mangaser, Ramon
Author_Institution :
Center for Adv. Interconnect Sci. & Technol., Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
The advent of copper as a commercial interconnect process means radical changes in back-end-of-line (BEOL) manufacturing. We examine the future of BEOL manufacturing guided by the 1997 National Technology Roadmap for Semiconductors. Changing to copper and future BEOL yield trends are emphasized
Keywords :
copper; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit yield; technological forecasting; BEOL manufacturing; BEOL yield trends; Cu; National Technology Roadmap for Semiconductors; back-end-of-line manufacturing; copper interconnect technology; interconnect process; Aluminum; CMOS technology; Clocks; Copper; Delay; Fabrication; Frequency estimation; Manufacturing processes; Materials science and technology; Semiconductor device manufacture;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-4380-8
DOI :
10.1109/ASMC.1998.731586
