DocumentCode
2362074
Title
Surface Acoustic Wave Delay Line for Biosensor Application
Author
Hirst, E.R. ; Xu, W.L. ; Bronlund, J.E. ; Yuan, Y.J.
Author_Institution
Sch. of Eng. & Technol., Massey Univ., Palmerston North
fYear
2008
fDate
2-4 Dec. 2008
Firstpage
40
Lastpage
44
Abstract
This paper presents the analysis, design and manufacture of a Surface Acoustic Wave (SAW) delay line for use as a bond-rupture biosensor. In contrast to commercial devices used in signal processing, the analyte changes the delay path of the developed device coating it in a layer of particles. The energy of the surface acoustic waves then removes the particles. Design constraints arise from both the manufacturing process and intended application. The developed device is reusable, durable and able withstand cleaning. As the device is in the prototype stage it is of reasonable size. The developed device is designed to work within an existing electronics system developed for quartz crystal microbalance bond-rupture; this places restrictions on the operating frequency of the device and impedance. Using established impulse response models the SAW device is designed for this application. Experimental results are compared with the simulation predictions and future improvements are considered.
Keywords
bioMEMS; biosensors; microbalances; microfabrication; microsensors; quartz; surface acoustic wave delay lines; surface acoustic wave sensors; transient response; SAW sensor; biosensor; impulse response model; microfabrication; prototype stage; quartz crystal microbalance bond-rupture; surface acoustic wave delay line; Acoustic signal processing; Acoustic waves; Biomedical signal processing; Biosensors; Bonding; Delay lines; Pulp manufacturing; Signal analysis; Surface acoustic wave devices; Surface acoustic waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Machine Vision in Practice, 2008. M2VIP 2008. 15th International Conference on
Conference_Location
Auckland
Print_ISBN
978-1-4244-3779-5
Electronic_ISBN
978-0-473-13532-4
Type
conf
DOI
10.1109/MMVIP.2008.4749504
Filename
4749504
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