DocumentCode
2362249
Title
Power transistor design guidelines and RF load-pull characterization of a 0.13-µm SOI CMOS technology
Author
Carrara, F. ; Presti, C.D. ; Palmisano, G. ; Scuderi, A.
Author_Institution
DIEES, Univ. di Catania, Catania, Italy
fYear
2009
fDate
14-18 Sept. 2009
Firstpage
444
Lastpage
447
Abstract
In this work, the RF power performance of a 0.13-mum partially depleted SOI CMOS technology is explored. To this end, a prototype 1-mm-width power transistor has been designed and fabricated for multi-harmonic load-pull characterization. The device tolerance to single-transistor latch-up under large-signal conditions has been considered as the key design issue for safe operation in RF power applications. Proper design criteria have been derived and the length of the gate fingers has been chosen accordingly. The test device achieves a 72% power-added efficiency and a 19.5-dBm output power level, while operating at a 2-V supply voltage under 1.9-GHz continuous-wave excitation.
Keywords
CMOS integrated circuits; power MOSFET; silicon-on-insulator; MOS transistors; RF load-pull characterization; SOI CMOS technology; continuous-wave excitation; device tolerance; frequency 1.9 GHz; power transistor design; power-added efficiency; silicon-on-insulator; single-transistor latch-up; size 0.13 mum; size 1 mm; transistor fabrication; voltage 2 V; CMOS technology; Guidelines; MOS devices; MOSFETs; Metal-insulator structures; Power transistors; Prototypes; Radio frequency; Substrates; Transformers;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European
Conference_Location
Athens
ISSN
1930-8876
Print_ISBN
978-1-4244-4351-2
Electronic_ISBN
1930-8876
Type
conf
DOI
10.1109/ESSDERC.2009.5331546
Filename
5331546
Link To Document