• DocumentCode
    2362254
  • Title

    TSC properties of epoxy composites cured with acid-anhydride

  • Author

    Wang, Jong-Bae ; Park, Geon-ho ; Jung, II-Hyung ; Shin, Cheol-Gi ; Lee, Joon-Ung

  • Author_Institution
    Dept. of Electr. Eng., Kwangwoon Univ., Seoul, South Korea
  • fYear
    1994
  • fDate
    7-9 Sep 1994
  • Firstpage
    552
  • Lastpage
    557
  • Abstract
    The TSC spectroscopy was applied to investigate an influence of structural change and interfacial state on the electrical properties of epoxy composites cured with acid-anhydride. A addition of over abundant hardener and inorganic filler separated a β peak near 10[°C] into two peaks of β1(10°C) and β2(20°C) and increased magnitude of TSC spectra between α and β peak, which would be closely related with the process of thermal oxidation and separation of hardener´s phenyl group according to an introduction of interfacial deformation, an expansion of free volume and a reduction of structural packing density. And the treatment of silane coupling agents on filler improved interfacial deformation to decrease the amplitude of TSC spectra
  • Keywords
    composite insulating materials; composite material interfaces; dielectric relaxation; electrets; epoxy insulation; interface states; interface structure; oxidation; thermally stimulated currents; 10 C; 20 C; TSC spectroscopy; electrical properties; epoxy composites cured with acid-anhydride; free volume expansion; inorganic filler; interfacial deformation; interfacial state; phenyl group; silane coupling agents; structural change; structural packing density reduction; thermal oxidation; Curing; Epoxy resins; Oxidation; Performance evaluation; Polarization; Silicon compounds; Spectroscopy; Temperature dependence; Temperature distribution; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrets, 1994. (ISE 8), 8th International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    0-7803-1940-0
  • Type

    conf

  • DOI
    10.1109/ISE.1994.514829
  • Filename
    514829