Better dispatch application-a success story [IC manufacture]

Author

Giegandt, Anke ; Nicholson, Gary

Author_Institution

Siemens AG, Munich, Germany

fYear

1998

fDate

23-25 Sep 1998

Firstpage

396

Lastpage

399

Abstract

Using priority rules, a project was conducted to implement a dispatching system in a high-volume semiconductor front-end production line. The specific goals of this project were to apply dispatch rules to reduce cycle time and balance the WIP in the line. This paper presents the project methodology, implemented dispatch policies and measurable results in different production areas, including furnace/wet etch, CMP, plasma etch, ion implantation, and lithography

Keywords

chemical mechanical polishing; dispatching; integrated circuit manufacture; ion implantation; lithography; manufacturing resources planning; production control; scheduling; sputter etching; CMP; IC manufacture; WIP balancing; cycle time; dispatch application; dispatch rules; dispatching system; furnace; implemented dispatch policies; ion implantation; lithography; plasma etch; priority rules; production areas; project methodology; volume semiconductor front-end production line; wet etch; Application specific integrated circuits; Area measurement; Dispatching; Furnaces; Manufacturing; Plasma applications; Plasma measurements; Production systems; Semiconductor device manufacture; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI

Conference_Location

Boston, MA

ISSN

1078-8743

Print_ISBN

0-7803-4380-8

Type

conf

DOI

10.1109/ASMC.1998.731632

Filename

731632