DocumentCode :
2362837
Title :
Better dispatch application-a success story [IC manufacture]
Author :
Giegandt, Anke ; Nicholson, Gary
Author_Institution :
Siemens AG, Munich, Germany
fYear :
1998
fDate :
23-25 Sep 1998
Firstpage :
396
Lastpage :
399
Abstract :
Using priority rules, a project was conducted to implement a dispatching system in a high-volume semiconductor front-end production line. The specific goals of this project were to apply dispatch rules to reduce cycle time and balance the WIP in the line. This paper presents the project methodology, implemented dispatch policies and measurable results in different production areas, including furnace/wet etch, CMP, plasma etch, ion implantation, and lithography
Keywords :
chemical mechanical polishing; dispatching; integrated circuit manufacture; ion implantation; lithography; manufacturing resources planning; production control; scheduling; sputter etching; CMP; IC manufacture; WIP balancing; cycle time; dispatch application; dispatch rules; dispatching system; furnace; implemented dispatch policies; ion implantation; lithography; plasma etch; priority rules; production areas; project methodology; volume semiconductor front-end production line; wet etch; Application specific integrated circuits; Area measurement; Dispatching; Furnaces; Manufacturing; Plasma applications; Plasma measurements; Production systems; Semiconductor device manufacture; Wet etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location :
Boston, MA
ISSN :
1078-8743
Print_ISBN :
0-7803-4380-8
Type :
conf
DOI :
10.1109/ASMC.1998.731632
Filename :
731632
Link To Document :
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