Batch size optimization of a furnace and pre-clean area by using dynamic simulations

Author

Rulkens, H.J.A. ; Van Campen, E.J.J. ; Van Herk, J. ; Rooda, J.E.

Author_Institution

Dept. of Production Control, Philips Semicond., Netherlands

fYear

1998

fDate

23-25 Sep 1998

Firstpage

439

Lastpage

444

Abstract

A dynamic simulation model is a powerful and fast tool to analyze existing production situations and to optimize the performance by evaluating alternative scheduling rules. This paper presents such an analysis and optimization for a furnace and pre-clean area of a wafer fab. The design of a dynamic model is described. Furthermore, experiments are described that illustrate the influence of a minimum batch size scheduling rule. For a specific production situation, the minimum batch sizes per furnace process which optimize cycle time are determined

Keywords

batch processing (industrial); integrated circuit manufacture; manufacturing resources planning; optimisation; production control; scheduling; semiconductor process modelling; surface cleaning; batch size optimization; cycle time optimization; dynamic model design; dynamic simulation model; dynamic simulations; furnace; furnace process; minimum batch size; minimum batch size scheduling rule; optimization; performance optimization; pre-clean area; production situation; production situation analysis; scheduling rules; wafer fab; Analytical models; Customer satisfaction; Dispatching; Dynamic scheduling; Fabrication; Furnaces; Performance analysis; Process design; Production; Semiconductor device modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI

Conference_Location

Boston, MA

ISSN

1078-8743

Print_ISBN

0-7803-4380-8

Type

conf

DOI

10.1109/ASMC.1998.731643

Filename

731643