Design and performance of integrated antennas for wireless intra chip interconnections

Author

Benech, Ph ; Ndagijimana, F. ; Triantafyllou, A. ; Farcy, A.

Author_Institution

ENSERG

fYear

2006

fDate

6-10 Nov. 2006

Firstpage

2953

Lastpage

2957

Abstract

Intra chip wireless interconnections using integrated antennas and microwaves travelling near the speed of light are being investigated to determine if these could alleviate the global interconnect limitations. Firstly theoretical investigations aboard the surface wave phenomenon. Then dipoles antennas of 1.98 mm length are integrated on silicon or SOI (silicon on insulator) substrates in a 130 nm CMOS technology. Their operation is demonstrated in frequencies around 27 GHz. Sufficient power transmission is measured between the antennas and high propagation speed improving the feasibility of the wireless interconnect system proposed here

Keywords

CMOS integrated circuits; dipole antennas; integrated circuit interconnections; silicon-on-insulator; CMOS technology; dipoles antennas; global interconnect limitations; integrated antennas; microwaves travelling; power transmission; silicon on insulator; substrates; wireless intra chip interconnections; Antenna measurements; Antennas and propagation; CMOS technology; Dipole antennas; Frequency; Microwave antennas; Power measurement; Power transmission; Silicon on insulator technology; Surface waves;

fLanguage

English

Publisher

ieee

Conference_Titel

IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on

Conference_Location

Paris

ISSN

1553-572X

Print_ISBN

1-4244-0390-1

Type

conf

DOI

10.1109/IECON.2006.347471

Filename

4152968