DocumentCode
2363155
Title
MOSAIC 1 product transfer using virtual flow concept
Author
Wang, Ping ; Spivey, Steve ; Warda, Edward ; Bowser, Mark ; Cosentino, Bridgette ; Zabasajja, Ed ; Shah, Piyush ; Imam, Salma ; Keller, John ; Fulton, Joe
Author_Institution
Motorola Inc., Mesa, AZ, USA
fYear
1998
fDate
23-25 Sep 1998
Firstpage
455
Lastpage
463
Abstract
Financial prosperity in wafer fabrication suggests that we must consolidate assets of contiguous and mature technology wafer fabs. Many complex challenges arise in fab consolidations. With transparent results to customers being the main objective, one intricate issue is the transfer of a technology. During the 4th quarter of 1996, Motorola Bipolar-3 (BP3) experienced a significant increase in request for product, particularly MOSAIC 1 technology. The demand exceeded BP3´s capacity. Since Motorola Bipolar-2 (BP2) ran similar processes and had excess capacity, it was decided to qualify the MOSAIC 1 technology in BP2. Since these two manufacturing areas do not have identical equipment and processes, it was extremely difficult to transfer and match processes and technology between these two fabs. This paper depicts a systematic approach in transferring MOSAIC 1 technology from BP3 to BP2. Novel techniques were applied that can be the framework for future transfers, which include development and use of the concept of virtual flow, and thorough documentation of the transfer. In addition, this paper provides a unique solution to the problems incurred with a particular device. The outcome, ahead of schedule, was a successful qualification of the device
Keywords
MOS analogue integrated circuits; integrated circuit manufacture; integrated circuit testing; manufacturing resources planning; technology transfer; MOSAIC 1 product transfer; MOSAIC 1 technology; MOSAIC 1 technology qualification; MOSAIC 1 technology transfer; Motorola Bipolar-2; Motorola Bipolar-3; contiguous technology wafer fabs; device qualification; financial prosperity; manufacturing areas; manufacturing equipment; manufacturing processes; mature technology wafer fabs; process capacity; process matching; request for product; technology transfer; transfer documentation; transfer framework; virtual flow; virtual flow concept; wafer fab consolidations; wafer fabrication; Annealing; Fabrication; Furnaces; Investments; Manufacturing processes; Oxidation; Quality management; Radio access networks; Technology management; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
0-7803-4380-8
Type
conf
DOI
10.1109/ASMC.1998.731646
Filename
731646
Link To Document