• DocumentCode
    2363155
  • Title

    MOSAIC 1 product transfer using virtual flow concept

  • Author

    Wang, Ping ; Spivey, Steve ; Warda, Edward ; Bowser, Mark ; Cosentino, Bridgette ; Zabasajja, Ed ; Shah, Piyush ; Imam, Salma ; Keller, John ; Fulton, Joe

  • Author_Institution
    Motorola Inc., Mesa, AZ, USA
  • fYear
    1998
  • fDate
    23-25 Sep 1998
  • Firstpage
    455
  • Lastpage
    463
  • Abstract
    Financial prosperity in wafer fabrication suggests that we must consolidate assets of contiguous and mature technology wafer fabs. Many complex challenges arise in fab consolidations. With transparent results to customers being the main objective, one intricate issue is the transfer of a technology. During the 4th quarter of 1996, Motorola Bipolar-3 (BP3) experienced a significant increase in request for product, particularly MOSAIC 1 technology. The demand exceeded BP3´s capacity. Since Motorola Bipolar-2 (BP2) ran similar processes and had excess capacity, it was decided to qualify the MOSAIC 1 technology in BP2. Since these two manufacturing areas do not have identical equipment and processes, it was extremely difficult to transfer and match processes and technology between these two fabs. This paper depicts a systematic approach in transferring MOSAIC 1 technology from BP3 to BP2. Novel techniques were applied that can be the framework for future transfers, which include development and use of the concept of virtual flow, and thorough documentation of the transfer. In addition, this paper provides a unique solution to the problems incurred with a particular device. The outcome, ahead of schedule, was a successful qualification of the device
  • Keywords
    MOS analogue integrated circuits; integrated circuit manufacture; integrated circuit testing; manufacturing resources planning; technology transfer; MOSAIC 1 product transfer; MOSAIC 1 technology; MOSAIC 1 technology qualification; MOSAIC 1 technology transfer; Motorola Bipolar-2; Motorola Bipolar-3; contiguous technology wafer fabs; device qualification; financial prosperity; manufacturing areas; manufacturing equipment; manufacturing processes; mature technology wafer fabs; process capacity; process matching; request for product; technology transfer; transfer documentation; transfer framework; virtual flow; virtual flow concept; wafer fab consolidations; wafer fabrication; Annealing; Fabrication; Furnaces; Investments; Manufacturing processes; Oxidation; Quality management; Radio access networks; Technology management; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
  • Conference_Location
    Boston, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-4380-8
  • Type

    conf

  • DOI
    10.1109/ASMC.1998.731646
  • Filename
    731646