Research of Reliability for Measuring High-g Micro Array Acceleration Sensor

High-g is the acceleration value, larger than 10⁵ g. For the requirements of detecting high g, people pay more and more attention to the reliability of an accelerometer. In this paper, the design and manufacture of high-g micro array acceleration sensor is researched to improve the reliability of the accelerometer. Owing to the superiority of MEMS manufacturing, in one processing, multiply micro-acceleration sensors with the same function can be integrated in one chip. According to the method of the array layout of multiple micro-acceleration sensors on a two-dimensional plane, the layout is ascertained by using multiple non-linear regression and orthogonal experimental design. Multiple micro-acceleration sensors lay reasonably to improve the reliability of the high-g micro array acceleration sensor. On the other hand, the linked line, which is used to transfer the signal from chip to the pin of the shell, becomes the weakness to resist the destructive impact. To the above problem, this paper focuses on thermosonic bonding and the analysis of the welding parameters such as temperature, time and pressure. With orthogonal experimental design, a number of experiments have been conducted to obtain the optimal welding parameters of pressure, temperature and time. The linked line of sensor system, which is manufactured according to these parameters, remains intact by the impact of 1.22 x 10⁵ g. Owing to optimized design and manufacture, the reliability of the acceleration is increased to 0.9906, which meets the requirements of the application.