DocumentCode :
2363673
Title :
Solidly mounted resonators with layer-transferred AlN using sacrificial crystalline surfaces
Author :
Allah, Mohamed Abd ; Thalhammer, Robert ; Kaitila, Jyrki ; Herzog, Thomas ; Weber, Werner ; Schmitt-Landsiedel, Doris
Author_Institution :
Lehrstuhl fur Tech. Elektron., Tech. Univ. Munchen, Munich, Germany
fYear :
2009
fDate :
14-18 Sept. 2009
Firstpage :
375
Lastpage :
378
Abstract :
A new process to manufacture solidly mounted bulk acoustic wave resonators using wafer bonding and sacrificial surface removal is introduced. With this process, AlN thin films are obtained having excellent c-axis orientation with XRD rocking curve FWHM of 1.36deg and material electromechanical coupling constant of 6.8% exceeding the epitaxial AlN electromechanical coupling constant. The resonators are working around 2.35 GHz and have Q-values as high as ~1300.
Keywords :
acoustic waves; aluminium compounds; joining processes; resonators; semiconductor device manufacture; semiconductor thin films; wafer bonding; AlN; electromechanical coupling; layer-transferred AlN; sacrificial crystalline surfaces; solidly mounted bulk acoustic wave resonators; thin films; wafer bonding; Acoustic devices; Acoustic waves; Crystallization; Electrodes; Mirrors; Resonance; Resonant frequency; Resonator filters; Surface acoustic waves; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European
Conference_Location :
Athens
ISSN :
1930-8876
Print_ISBN :
978-1-4244-4351-2
Electronic_ISBN :
1930-8876
Type :
conf
DOI :
10.1109/ESSDERC.2009.5331616
Filename :
5331616
Link To Document :
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