Title :
Ultrasonic complex vibration welding systems of 100 kHz to 200 kHz with large welding tip area for packaging in microelectronics
Author :
Tsujino, Jiromaru ; Harada, Yoshiki ; Sano, Tsutomu
Author_Institution :
Fac. of Eng., Kanagawa Univ., Yokohama, Japan
Abstract :
Ultrasonic complex vibration welding systems of 100 to 200 kHz using a complex vibration welding tip with large area vibrating in elliptical to circular locus were studied. The complex vibration systems have a welding tip part of 21 mm×21 mm area which is available for direct welding of semiconductor tips of 20 mm square on substrate (face down bonding) and packaging of various electronic devices
Keywords :
integrated circuit packaging; ultrasonic welding; vibrations; 100 to 200 kHz; microelectronics packaging; semiconductor tip; ultrasonic complex vibration welding system; welding tip area; Bonding; Clamps; Electronics packaging; Microelectronics; Packaging machines; Semiconductor device packaging; Substrates; Vibration measurement; Voltage; Welding;
Conference_Titel :
Ultrasonics Symposium, 2001 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-7177-1
DOI :
10.1109/ULTSYM.2001.991814
