DocumentCode
2364493
Title
Ultrasonic complex vibration welding systems of 100 kHz to 200 kHz with large welding tip area for packaging in microelectronics
Author
Tsujino, Jiromaru ; Harada, Yoshiki ; Sano, Tsutomu
Author_Institution
Fac. of Eng., Kanagawa Univ., Yokohama, Japan
Volume
1
fYear
2001
fDate
2001
Firstpage
665
Abstract
Ultrasonic complex vibration welding systems of 100 to 200 kHz using a complex vibration welding tip with large area vibrating in elliptical to circular locus were studied. The complex vibration systems have a welding tip part of 21 mm×21 mm area which is available for direct welding of semiconductor tips of 20 mm square on substrate (face down bonding) and packaging of various electronic devices
Keywords
integrated circuit packaging; ultrasonic welding; vibrations; 100 to 200 kHz; microelectronics packaging; semiconductor tip; ultrasonic complex vibration welding system; welding tip area; Bonding; Clamps; Electronics packaging; Microelectronics; Packaging machines; Semiconductor device packaging; Substrates; Vibration measurement; Voltage; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2001 IEEE
Conference_Location
Atlanta, GA
Print_ISBN
0-7803-7177-1
Type
conf
DOI
10.1109/ULTSYM.2001.991814
Filename
991814
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