Title :
Reworkable encapsulation
Author :
Buchwalter, Stephen L. ; Gelorme, Jeffrey D.
Author_Institution :
Res. Div., IBM Corp., Yorktown Heights, NY, USA
Abstract :
Epoxy thermosetting plastics continue to be a mainstay for electronic packaging, because of their ability to provide high reliability at low cost, One negative associated with the use of epoxy thermosets is their intractability after curing, which prevents their removal for rework or recycling of microelectronic assemblies. As a solution to this problem, we report on the development of a new functional equivalent, thermosetting epoxy which is easily removed
Keywords :
encapsulation; packaging; polymers; electronic packaging; epoxy thermosetting plastics; high reliability; microelectronic assemblies; reworkable encapsulation; Assembly; Curing; Encapsulation; Flip chip; Material properties; Materials testing; Microelectronics; Semiconductor device packaging; Semiconductor devices; Solvents;
Conference_Titel :
Electronics and the Environment, 1995. ISEE., Proceedings of the 1995 IEEE International Symposium on
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-2137-5
DOI :
10.1109/ISEE.1995.514954
