Process design and optimization for environmentally conscious printed circuit board assemblies

Author

Rupp, Guy ; Graham, Stephan

Author_Institution

DSC Commun. Corp., Plano, TX, USA

fYear

1995

fDate

1-3 May 1995

Firstpage

95

Lastpage

99

Abstract

This paper discusses an engineering approach to the qualification of water based flux as a substitute for conventional alcohol based volatile organic compound (VOC) flux and utilization of “No-Clean” soldering material, virtually eliminating saponified waste water effluent and VOC emissions typically associated with surface mount technology (SMT) printed circuit board assembly (PCBA). The information and experiences are provided through a discussion of critical equipment, material requirements and evaluations, as well as the selection methodology and criteria

Keywords

environmental factors; printed circuit manufacture; soldering; surface mount technology; environmentally conscious production; material requirements; no-clean soldering material; printed circuit board assemblies; process design; process optimization; selection methodology; surface mount technology; water based flux; Design optimization; Effluents; Organic materials; Printed circuits; Process design; Qualifications; Soldering; Surface-mount technology; Volatile organic compounds; Waste materials;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and the Environment, 1995. ISEE., Proceedings of the 1995 IEEE International Symposium on

Conference_Location

Orlando, FL

Print_ISBN

0-7803-2137-5

Type

conf

DOI

10.1109/ISEE.1995.514957

Filename

514957