DocumentCode :
2364625
Title :
Is it the end of the road for silicon in power conversion?
Author :
Lidow, Alex
Author_Institution :
Efficient Power Conversion Corp., El Segundo, CA, USA
fYear :
2011
fDate :
9-11 Oct. 2011
Firstpage :
119
Lastpage :
124
Abstract :
For the past three decades, power management efficiency and cost have shown steady improvement as innovations in power MOSFET structures, technology, and circuit topologies have paced the growing need for electrical power in our daily lives. In the last few years, however, the rate of improvement has slowed as the silicon power MOSFET has asymptotically approached its theoretical bounds. We address the new game-changing power management products, available today and planned for the near future, that are built on Gallium Nitride grown on top of a silicon substrate. Enhancement mode devices (eGaN® FETs) are demonstrated in DC-DC conversion applications. Roadmaps for improved device performance and for system-on-chip integration will also be discussed. Performance is only one dimension of the equation leading to the conclusion that eGaN technology is a game changer. The other dimensions are product reliability, ease of use, and cost. These topics will also be discussed showing that the capability to displace silicon across a significant portion of the power management market is now in hand.
Keywords :
DC-DC power convertors; III-V semiconductors; elemental semiconductors; gallium compounds; network topology; power MOSFET; semiconductor device reliability; silicon; wide band gap semiconductors; DC-DC conversion applications; GaN; Si; circuit topologies; game-changing power management products; power MOSFET; power management efficiency; power management market; system-on-chip integration; Epitaxial growth; FETs; Gallium nitride; Power MOSFET; Reliability; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2011 IEEE
Conference_Location :
Atlanta, GA
ISSN :
1088-9299
Print_ISBN :
978-1-61284-165-6
Type :
conf
DOI :
10.1109/BCTM.2011.6082762
Filename :
6082762
Link To Document :
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