• DocumentCode
    2365335
  • Title

    Structural and wetting properties of metal polymer nanocomposites

  • Author

    Han, Z.J. ; Tay, B.K. ; Ha, P.C.T. ; Shakerzadeh, M. ; You, G.F.

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
  • fYear
    2008
  • fDate
    24-27 March 2008
  • Firstpage
    64
  • Lastpage
    68
  • Abstract
    Polystyrene thin films of thickness 180-200 nm are modified by plasma immersion ion implantation and deposition (PIII&D) technique together with titanium filtered cathodic vacuum arc. The surface structure of modified films turns into a metal polymer nanocomposite where Ti nanoclusters of spatial size 10 - 20 nm are embedded in polystyrene matrices. Such structural formation is the interplay between ion sputtering and ion diffusion effect. The wetting properties of this nanocomposite, such as contact angle aging effect and hysteresis are investigated. The changes in various properties are believed to be due to structure of polymer nanocomposites as well as the basic principles of ion polymer interaction.
  • Keywords
    ageing; contact angle; hysteresis; nanocomposites; plasma deposition; plasma immersion ion implantation; polymer films; surface structure; wetting; Ti nanoclusters; contact angle aging effect; hysteresis; ion polymer interaction; ion sputtering; metal polymer nanocomposites; plasma immersion ion deposition; plasma immersion ion implantation; polystyrene matrices; polystyrene thin film; structural properties; surface structure; titanium filtered cathodic vacuum arc; wetting properties; Aging; Hysteresis; Nanocomposites; Plasma immersion ion implantation; Polymer films; Sputtering; Surface structures; Titanium; Vacuum arcs; Vacuum technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1572-4
  • Electronic_ISBN
    978-1-4244-1573-1
  • Type

    conf

  • DOI
    10.1109/INEC.2008.4585438
  • Filename
    4585438