• DocumentCode
    2365387
  • Title

    Electrical and optical properties of nanostructured Copper (I) Iodide thin films for DSSC

  • Author

    Amalina, M.N. ; Musa, M.Z. ; Rusop, M.

  • Author_Institution
    NANO - Electron. Center (NET), Univ. Teknol. MARA (UiTM), Shah Alam, Malaysia
  • fYear
    2011
  • fDate
    25-27 April 2011
  • Firstpage
    258
  • Lastpage
    262
  • Abstract
    This research focuses on the effect of thickness of CuI thin film for solid state dye sensitized solar cells application. Spin coating technique is done by varying the deposition layer that increases the film thickness. The 0.05 M of CuI solution is prepared at room temperature and deposited on the glass substrate. The electrical and optical properties were characterized by solar simulator and ultraviolet-visible -near infrared (UV-Vis-NIR) measurement respectively. The electrical characteristics indicate that the resistivity increases as the thickness increase due to difficulty of electron movement. Meanwhile, for the optical properties the films exhibited an optical transmittance of 86%-96% between 450nm to 800nm of wavelength.
  • Keywords
    copper compounds; electrical resistivity; infrared spectra; light transmission; nanofabrication; nanostructured materials; spin coating; thin films; ultraviolet spectra; visible spectra; CuI; SiO2; electrical properties; electrical resistivity; glass substrate; nanostructured copper (I) iodide thin films; optical properties; optical transmittance; solar simulator; solid state dye sensitized solar cells; spin coating; temperature 293 K to 298 K; ultraviolet-visible-near infrared spectra; wavelength 450 nm to 800 nm; Absorption; Conductivity; Optical films; Optical sensors; Photonic band gap; Photovoltaic cells; CuI thin films; Electrical properties; Optical properties; Thin film thickness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Devices, Systems and Applications (ICEDSA), 2011 International Conference on
  • Conference_Location
    Kuala Lumpur
  • ISSN
    2159-2047
  • Print_ISBN
    978-1-61284-388-9
  • Type

    conf

  • DOI
    10.1109/ICEDSA.2011.5959069
  • Filename
    5959069