• DocumentCode
    2365580
  • Title

    [Cover]

  • fYear
    2006
  • fDate
    15-17 March 2006
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The following topics are dealt with: advanced packaging materials; lead free solders; conducting polymers; nanoparticles; and adhesives
  • Keywords
    adhesives; conducting polymers; electronics packaging; nanoparticles; solders; adhesives; advanced packaging materials; conducting polymers; lead free solders; nanoparticles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
  • Conference_Location
    Atlanta, GA
  • ISSN
    1550-5723
  • Print_ISBN
    1-4244-0260-3
  • Type

    conf

  • DOI
    10.1109/ISAPM.2006.1665971
  • Filename
    1665971
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2365580