Abstract :
The following topics are dealt with: advanced packaging materials; lead free solders; conducting polymers; nanoparticles; and adhesives
Keywords :
adhesives; conducting polymers; electronics packaging; nanoparticles; solders; adhesives; advanced packaging materials; conducting polymers; lead free solders; nanoparticles;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
1-4244-0260-3
DOI :
10.1109/ISAPM.2006.1665971
