Title :
Al/Ti Schottky barrier diodes with the guard-ring termination for 6H-SiC
Author :
Ueno, Katsunori ; Urushidani, Tatsuo ; Hashimoto, Kouichi ; Seki, Yasukazu
Author_Institution :
Fuji Electr. Corp. Res. & Dev. Ltd., Matsumoto, Japan
Abstract :
In this report, three important technologies for SiC power devices are studied. One is the isolation technology for a p-n junction utilizing the local oxidation technique. For the second, Al/Ti is investigated as a Schottky metal, in which wet etching and the high temperature annealing are applicable. Finally, we propose a guard-ring structure as the edge termination for Schottky barrier diodes to sustain high voltage. The mesa structure of the guard ring is fabricated by local oxidation. The fabrication results showed that the guard-ring structure has improved the breakdown voltage to as high as p-n junction diodes
Keywords :
Schottky diodes; aluminium alloys; annealing; etching; isolation technology; oxidation; power semiconductor diodes; silicon compounds; titanium alloys; wide band gap semiconductors; 6H-SiC; Al-Ti Schottky metal; AlTi-SiC; Schottky barrier diodes; SiC power devices; breakdown voltage; edge termination; fabrication; guard-ring termination; high temperature annealing; isolation technology; local oxidation technique; mesa structure; p-n junction; wet etching; Annealing; Isolation technology; Oxidation; P-n junctions; Schottky barriers; Schottky diodes; Silicon carbide; Temperature; Voltage; Wet etching;
Conference_Titel :
Power Semiconductor Devices and ICs, 1995. ISPSD '95., Proceedings of the 7th International Symposium on
Conference_Location :
Yokohama
Print_ISBN :
0-7803-2618-0
DOI :
10.1109/ISPSD.1995.515018