Title :
Semiconductor Packaging Materials Outlook
Author :
Vardaman, E. Jan
Author_Institution :
TechSearch Int. Inc., Austin, TX
Abstract :
Summary form only given. Semiconductor packaging materials are a key to the success of the semiconductor business in total. Changes in consumer electronics are driving the changes in packaging materials. This presentation highlights the market growth and trends in laminate substrates, lead frames, wafer level packaging dielectrics, bonding wire, encapsulants and molding compounds, thermal interface materials, and solder spheres. The impact of today´s BT-resin shortage, laminate substrate shortage, and the rising prices of metals are discussed
Keywords :
consumer electronics; electronics packaging; encapsulation; lead bonding; moulding; thermal insulating materials; BT-resin shortage; bonding wires; consumer electronics; laminate substrates; lead frames; semiconductor packaging materials; solder spheres; thermal interface materials; wafer level packaging dielectrics; Consumer electronics; Dielectric materials; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Laminates; Lead; Semiconductor device packaging; Semiconductor materials; Wafer scale integration;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
1-4244-0260-3
DOI :
10.1109/ISAPM.2006.1665983
