Title :
Materials and Processing Impacts on Flip Chip Assembly using Pre-applied Underfill
Author_Institution :
GE Global Res., Niskayuna, NY
Abstract :
Summary form only given. Pre-applied underfill materials for eutectic tin lead flip chip solder attach have been developed to produce void free, reliable assemblies. Lead free flip solder attach presents a number of challenges for quality assembly using pre-applied underfill. Factors that effect fluxing, yield, and voiding will be addressed
Keywords :
assembling; electronics packaging; flip-chip devices; soldering; solders; eutectic tin lead flip chip solder; flip chip assembly; lead free flip solder attach; materials processing; pre-applied underfill; Assembly; Environmentally friendly manufacturing techniques; Flip chip; Lead; Materials reliability; Tin;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
1-4244-0260-3
DOI :
10.1109/ISAPM.2006.1665986
