DocumentCode
2366083
Title
Materials Challenges and Solutions for the Packaging of High Power LEDs
Author
Lin, G. ; Zhou, Yan ; Tran, Nugen ; Chiang, Weichun ; He, Yongzhi ; Shi, Frank G.
Author_Institution
California Univ., Irvine, CA
fYear
0
fDate
0-0 0
Firstpage
63
Lastpage
63
Abstract
Abstract form only given. As a future lighting source, high power LED lighting is significant in that it provides decades of lifetime under normal operation, requiring a fraction of the power required for traditional lighting solutions. For LED lighting to be a viable lighting source, there are many technical challenges to be resolved. Among them the light extraction efficiency, the chip over heating, the thermal and radiation degradation of the optical output power are the key issues, which turn out are all related to the packaging materials. This work will outline those challenges in details and report the recent progress in resolving those key problems
Keywords
light emitting diodes; light sources; packaging; chip over heating; high power LED packaging; lighting source; packaging materials; radiation degradation; thermal degradation; Heating; Helium; LED lamps; Light emitting diodes; Optical materials; Packaging; Thermal degradation;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location
Atlanta, GA
ISSN
1550-5723
Print_ISBN
1-4244-0260-3
Type
conf
DOI
10.1109/ISAPM.2006.1665998
Filename
1665998
Link To Document