• DocumentCode
    2366083
  • Title

    Materials Challenges and Solutions for the Packaging of High Power LEDs

  • Author

    Lin, G. ; Zhou, Yan ; Tran, Nugen ; Chiang, Weichun ; He, Yongzhi ; Shi, Frank G.

  • Author_Institution
    California Univ., Irvine, CA
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    63
  • Lastpage
    63
  • Abstract
    Abstract form only given. As a future lighting source, high power LED lighting is significant in that it provides decades of lifetime under normal operation, requiring a fraction of the power required for traditional lighting solutions. For LED lighting to be a viable lighting source, there are many technical challenges to be resolved. Among them the light extraction efficiency, the chip over heating, the thermal and radiation degradation of the optical output power are the key issues, which turn out are all related to the packaging materials. This work will outline those challenges in details and report the recent progress in resolving those key problems
  • Keywords
    light emitting diodes; light sources; packaging; chip over heating; high power LED packaging; lighting source; packaging materials; radiation degradation; thermal degradation; Heating; Helium; LED lamps; Light emitting diodes; Optical materials; Packaging; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
  • Conference_Location
    Atlanta, GA
  • ISSN
    1550-5723
  • Print_ISBN
    1-4244-0260-3
  • Type

    conf

  • DOI
    10.1109/ISAPM.2006.1665998
  • Filename
    1665998