Integration of a subscriber line interface circuit (SLIC) in a new 170 V smart power technology

Author

Zojer, Bernhard ; Koban, Rüdiger ; Petschacher, Reinhard ; Sereinig, Wolfgang

Author_Institution

Siemens Microelectron. Design Center, Villach, Austria

fYear

1995

fDate

23-25 May 1995

Firstpage

293

Lastpage

297

Abstract

The presented IC performs the high-voltage functions of an electronic central office subscriber line interface without the need for any transformers or relays. The challenges of SLIC integration stem from the combination of requirements: 150 V supply, 0.2% accuracy and up to 200 nF loads, while operating in a harsh environment. A new BCD-process and circuitry that emphasizes the relative merits of the devices (e.g. buffers with DMOS outputs, n-type supply voltage switch, accuracy by polyresistors) yielded a 30 mm² rugged SLIC in the first design step. All transmission specifications are met without trimming

Keywords

BiCMOS analogue integrated circuits; integrated circuit technology; power integrated circuits; subscriber loops; 170 V; BCD-process; DMOS outputs; SLIC integration; buffers; electronic central office; high-voltage functions; n-type supply voltage switch; polyresistors; smart power technology; subscriber line interface circuit; Breakdown voltage; Circuits; Costs; Isolation technology; Microelectronics; Relays; Robust stability; Surface resistance; Switches; Telephony;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices and ICs, 1995. ISPSD '95., Proceedings of the 7th International Symposium on

Conference_Location

Yokohama

ISSN

1063-6854

Print_ISBN

0-7803-2618-0

Type

conf

DOI

10.1109/ISPSD.1995.515052

Filename

515052