Embedded Thin Film Resistors on BCB by Low-Cost PWB Compatible Electroless Plating by Direct Foil Lamination Transfer Processes

Author

Bhattacharya, Swapan K. ; Varadarajan, Mahesh ; Johnston, Seth ; Lee, K.J. ; Sitaraman, Suresh ; Tummala, Rao

Author_Institution

Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA

fYear

0

fDate

0-0 0

Firstpage

116

Lastpage

116

Abstract

Benzocyclobutene (BCB) has been proposed as a board level dielectric for advanced system-on-package (SOP) module primarily due to its attractive low-loss (for RF application) and thin film (for high density wiring) properties. Realization of embedded resistors on low loss benzocyclobutene (dielectric loss ~0.0008 at > 40 GHz) has been explored in this study. Two approaches, viz, foil transfer and electroless plating have been attempted for deposition of thin film resistors on benzocyclobutene (BCB). Ni-P alloys were plated using conventional electroless plating, and NiCr and NiCrAlSi foils were used for the foil transfer process. This paper reports NiP and NiWP electroless plated embedded resistors on BCB dielectric for the first time in the literature

Keywords

chromium alloys; dielectric materials; electroless deposition; nickel alloys; phosphorus alloys; polymers; printed circuits; system-in-package; thin film resistors; NiCr; NiCrAlSi; NiP; NiWP; benzocyclobutene; direct foil lamination transfer; electroless plating; printed wiring boards; system-on-package; thin film resistors; Dielectric losses; Dielectric thin films; Electric resistance; Lamination; Packaging; Radio frequency; Resistors; Sputtering; Transistors; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on

Conference_Location

Atlanta, GA

ISSN

1550-5723

Print_ISBN

1-4244-0260-3

Type

conf

DOI

10.1109/ISAPM.2006.1666014

Filename

1666014