• DocumentCode
    2366380
  • Title

    Higher drive current for SiGe nanowires

  • Author

    Chang, Kow-Ming ; Kuo, Jiun-ming ; Wu, Heng-hsin ; Tzeng, Wen-Hsien ; Wu, Tzu-liu ; Chao, Wen-chan

  • Author_Institution
    Dept. of Electron. Eng. Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu
  • fYear
    2008
  • fDate
    24-27 March 2008
  • Firstpage
    315
  • Lastpage
    319
  • Abstract
    Nanowire is mainly used in biological sensor because it has the high surface-to-volume ratio. In this study, we have successfully fabricated the Poly-Si and SiGe nanowire with Ge = 7% and 11 % respectively by side-wall spacer technique. In order to normalize the drive current of nanowires, we consider the nanowire as a resistance. The conductance is chose for comparison between the nanowires. The higher conductance achieved of SiGe nanowire with/without nanowire implantation and the SiGe nanowire with higher Ge concentration had higher conductance. However, the disadvantage of lower contact resistance is found in SiGe pad. The 3-amino-propy-ltriethoxy-silane (APTES) was used to modify the surface, which can detect the charge with different pH. Comparing the conductance change; the SiGe nanowire with higher Ge concentration improved the sensitivity. But the over-higher Ge concentration (40%) did not increase the sensitivity; the reason maybe the higher defect appears at the surface as higher Ge concentration.
  • Keywords
    Ge-Si alloys; contact resistance; crystal defects; electrical conductivity; electrical resistivity; nanowires; organic compounds; pH; semiconductor quantum wires; 3-amino-propy-ltriethoxy-silane; SiGe; biological sensor; conductance; contact resistance; drive current; germanium concentration; nanowires; pH; side-wall spacer; surface defect; Germanium silicon alloys; Nanoelectronics; Nanowires; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1572-4
  • Electronic_ISBN
    978-1-4244-1573-1
  • Type

    conf

  • DOI
    10.1109/INEC.2008.4585495
  • Filename
    4585495