DocumentCode :
2366522
Title :
Post Buckling Analysis of Thin Membrane for the Flexible Electronics
Author :
Park, Seungbae ; Gao, Jia ; Agrawal, Deepak ; Pitarresi, James ; Homentcovsch, Dorel
Author_Institution :
Dept. of Mech. Eng., New York State Univ., Binghamton, NY
fYear :
0
fDate :
0-0 0
Firstpage :
145
Lastpage :
145
Abstract :
This paper presents the experiment work and numerical solution to investigate wrinkle formation and evolution in thin membranes at elevated temperatures. The specimens consist of Kapton circular membranes supported on steel substrate. The membranes were heated from room temperature to 100deg. The DIC (digital image correlation) was used to monitor the profiles of membranes at discrete temperatures. The nonlinear post buckling analysis was used for numerical study of membrane wrinkling. The nonlinear post buckling solution shows that the global buckling of membrane significantly reduces bending stiffness thus to create localized buckling modes accounting for the wrinkle generation. The wrinkle evolution is stable until the temperature reaches the next critical value. After this critical temperature, the wrinkle evolution is accelerated until the final temperature. The finite element simulation results are consistent with experimental observations
Keywords :
bending; buckling; finite element analysis; flexible electronics; image processing; membranes; substrates; 100 C; Kapton circular membranes; bending stiffness; digital image correlation; finite element simulation; flexible electronics; nonlinear post buckling; post buckling analysis; thin membrane; wrinkle evolution; wrinkle formation; Acceleration; Biomembranes; Digital images; Finite element methods; Flexible electronics; Mechanical engineering; Monitoring; Steel; Temperature; USA Councils;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location :
Atlanta, GA
ISSN :
1550-5723
Print_ISBN :
1-4244-0260-3
Type :
conf
DOI :
10.1109/ISAPM.2006.1666024
Filename :
1666024
Link To Document :
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