DocumentCode
2366524
Title
Die level CDM testing duplicates assembly operation failures
Author
Bernier, By Joe ; Croft, Gregg
Author_Institution
Harris Semicond., Melbourne, FL, USA
fYear
1996
fDate
10-12 Sept. 1996
Firstpage
117
Lastpage
122
Abstract
Field induced charged device model (FCDM) testing on individual dice has shown that die sort operations can cause electrostatic discharge (ESD) failures. CDM pulses as low as 100 volts to the back side of a die duplicated production failures. Static generated by the separation of dice from the wafer saw mounting film was found to be the underlying cause.
Keywords
assembling; electrostatic discharge; failure analysis; integrated circuit testing; 100 V; CDM testing; assembly operation failure; dice separation; die sort; electrostatic discharge; field induced charged device model; wafer saw mounting film; Assembly; Electrostatic discharges; Failure analysis; Integrated circuit testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium, 1996. Proceedings
Print_ISBN
1-878303-69-4
Type
conf
DOI
10.1109/EOSESD.1996.865133
Filename
865133
Link To Document