• DocumentCode
    2366575
  • Title

    Testing nanometer digital integrated circuits: myths, reality and the road ahead

  • Author

    Blanton, Shawn ; Mitra, Subhasish

  • Author_Institution
    Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    2005
  • fDate
    3-7 Jan. 2005
  • Firstpage
    8
  • Lastpage
    9
  • Abstract
    High-test quality plays a central role in the development of successful products used for building robust computing and communication systems. Hence, high-test quality enablers are rapidly becoming "features", just like performance, power-consumption and die size. This tutorial includes in-depth discussions on two major test topics that are essential for designs manufactured in nanometer technologies: test compression and diagnosis. Test compression techniques enable orders of magnitude improvement (reduction) in test cost and pave the path for successful implementation of built-in-self-test features. Ensuring products yield with sufficient quality also requires techniques for identifying and characterizing defects. This tutorial describes state-of-the-art techniques for performing defect diagnosis and how such techniques are key in enabling high-yielding and high-quality products. Supporting data from actual designs and manufacturing processes are presented.
  • Keywords
    built-in self test; fault diagnosis; integrated circuit testing; integrated circuit yield; logic testing; nanoelectronics; built-in-self-test features; defect diagnosis; high-test quality; magnitude improvement; manufacturing processes; nanometer digital integrated circuit testing; nanometer technology; test compression; test cost reduction; Automatic testing; Circuit testing; Digital integrated circuits; Integrated circuit testing; Manufacturing; Micromechanical devices; Roads; Robustness; System testing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2005. 18th International Conference on
  • ISSN
    1063-9667
  • Print_ISBN
    0-7695-2264-5
  • Type

    conf

  • DOI
    10.1109/ICVD.2005.162
  • Filename
    1383236